PCBA process

1) conventional dual-panel technology and techniques.

①---boreholes---hole and full plate electroplating---transfer (film, exposure and development)------etching and annealing film solder mask and character---HAL, or OSP---contouring---test---finished

② materials---boreholes------------plating pattern transfer back to hole film etching---back and resist film (Sn or Sn/pb)------plated plug solder mask and character---HAL, or OSP---contouring---test---finished

2) conventional multilayer process and technology.

Open---internal layer of oxidation pressure---boreholes---------hole plating (full Board and pattern plating)---the outer produce coating------surface contouring---test---finished